Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10841679 | Microelectromechanical systems package structure | Hsu-Liang Hsiao, Pu-Shan Huang, Ching-Han Huang, Lu-Ming Lai | 2020-11-17 |
| 10804413 | Package component | — | 2020-10-13 |
| 10734337 | Semiconductor package device having glass transition temperature greater than binding layer temperature | Kuang-Hsiung Chen, Yu-Ying Lee, Sheng-Ming Wang, Wun-Jheng Syu | 2020-08-04 |
| 10720751 | Optical package structure, optical module, and method for manufacturing the same | Lu-Ming Lai, Ying-Chung Chen, Shih-Chieh Tang | 2020-07-21 |
| 10689248 | Semiconductor device package and method of manufacturing the same | Ming-Yen Lee, Chia-Hao Sung, Ching-Han Huang | 2020-06-23 |
| 10526200 | Semiconductor device package including cover including tilted inner sidewall | Ching-Han Huang, Hsun-Wei Chan | 2020-01-07 |