Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10841679 | Microelectromechanical systems package structure | Hsu-Liang Hsiao, Yu-Hsuan Tsai, Pu-Shan Huang, Lu-Ming Lai | 2020-11-17 |
| 10812017 | Semiconductor package structure | Chi-Sheng Tseng, Lu-Ming Lai, Hui-Chung Liu, Kuo-Hua LAI, Cheng-Ling Huang | 2020-10-20 |
| 10782184 | Optical device and method of manufacturing the same | Yu-Min Peng, Lu-Ming Lai | 2020-09-22 |
| 10689248 | Semiconductor device package and method of manufacturing the same | Ming-Yen Lee, Chia-Hao Sung, Yu-Hsuan Tsai | 2020-06-23 |
| 10689249 | Semiconductor device package including a wall and a grounding ring exposed from the wall | Hsun-Wei Chan, Lu-Ming Lai | 2020-06-23 |
| 10526200 | Semiconductor device package including cover including tilted inner sidewall | Hsun-Wei Chan, Yu-Hsuan Tsai | 2020-01-07 |