Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10841679 | Microelectromechanical systems package structure | Hsu-Liang Hsiao, Yu-Hsuan Tsai, Ching-Han Huang, Lu-Ming Lai | 2020-11-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10841679 | Microelectromechanical systems package structure | Hsu-Liang Hsiao, Yu-Hsuan Tsai, Ching-Han Huang, Lu-Ming Lai | 2020-11-17 |