Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879159 | Substrate, semiconductor package thereof and process of making same | Tien-Szu Chen, Sheng-Ming Wang, Kuang-Hsiung Chen | 2020-12-29 |
| 10741482 | Semiconductor device package | — | 2020-08-11 |
| 10734337 | Semiconductor package device having glass transition temperature greater than binding layer temperature | Kuang-Hsiung Chen, Yu-Hsuan Tsai, Sheng-Ming Wang, Wun-Jheng Syu | 2020-08-04 |
| 10665765 | Semiconductor device package and a method of manufacturing the same | Mei-Yi Wu, Lu-Ming Lai, Yung-Yi Chang | 2020-05-26 |