Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879159 | Substrate, semiconductor package thereof and process of making same | Tien-Szu Chen, Kuang-Hsiung Chen, Yu-Ying Lee | 2020-12-29 |
| 10854550 | Semiconductor package and method of manufacturing the same | Tien-Szu Chen, Wen-Chih Shen, Hsing-Wen Lee, Hsiang-Ming Feng | 2020-12-01 |
| 10734337 | Semiconductor package device having glass transition temperature greater than binding layer temperature | Kuang-Hsiung Chen, Yu-Hsuan Tsai, Yu-Ying Lee, Wun-Jheng Syu | 2020-08-04 |
| 10629519 | Semiconductor device package and method of manufacturing the same | Tien-Szu Chen, I-Cheng Wang, Wun-Jheng Syu | 2020-04-21 |
| 10573624 | Semiconductor device package and method of manufacturing the same | Tien-Szu Chen, Kuang-Hsiung Chen, I-Cheng Wang, Wun-Jheng Syu | 2020-02-25 |