Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879159 | Substrate, semiconductor package thereof and process of making same | Sheng-Ming Wang, Kuang-Hsiung Chen, Yu-Ying Lee | 2020-12-29 |
| 10854550 | Semiconductor package and method of manufacturing the same | Sheng-Ming Wang, Wen-Chih Shen, Hsing-Wen Lee, Hsiang-Ming Feng | 2020-12-01 |
| 10629519 | Semiconductor device package and method of manufacturing the same | Sheng-Ming Wang, I-Cheng Wang, Wun-Jheng Syu | 2020-04-21 |
| 10573624 | Semiconductor device package and method of manufacturing the same | Kuang-Hsiung Chen, Sheng-Ming Wang, I-Cheng Wang, Wun-Jheng Syu | 2020-02-25 |