Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879159 | Substrate, semiconductor package thereof and process of making same | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee | 2020-12-29 |
| 10734337 | Semiconductor package device having glass transition temperature greater than binding layer temperature | Yu-Hsuan Tsai, Yu-Ying Lee, Sheng-Ming Wang, Wun-Jheng Syu | 2020-08-04 |
| 10643863 | Semiconductor package and method of manufacturing the same | You-Lung Yen, Shing-Cheng Liang, Pei-Yu Hsu | 2020-05-05 |
| 10573624 | Semiconductor device package and method of manufacturing the same | Tien-Szu Chen, Sheng-Ming Wang, I-Cheng Wang, Wun-Jheng Syu | 2020-02-25 |