Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10755994 | Semiconductor package structure and semiconductor substrate | — | 2020-08-25 |
| 10643863 | Semiconductor package and method of manufacturing the same | Kuang-Hsiung Chen, Shing-Cheng Liang, Pei-Yu Hsu | 2020-05-05 |