Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510734 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai +2 more | 2019-12-17 |
| 10347548 | Integrated circuit package structure and testing method using the same | Tsung-Te Chou, Chen-Hua Lin, Huang-Wen Tseng, Chwen-Ming Liu | 2019-07-09 |
| 10276548 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai +2 more | 2019-04-30 |