Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347548 | Integrated circuit package structure and testing method using the same | Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Chwen-Ming Liu | 2019-07-09 |
TC
Tsung-Te Chou
Overall (2019): #235,622 of 560,194Top 45%
1
Patents 2019