Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347548 | Integrated circuit package structure and testing method using the same | Yang-Che Chen, Tsung-Te Chou, Chen-Hua Lin, Huang-Wen Tseng | 2019-07-09 |
CL
Chwen-Ming Liu
Overall (2019): #510,682 of 560,194Top 95%
1
Patents 2019