Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510597 | Methods for hybrid wafer bonding integrated with CMOS processing | Pin-Nan Tseng, Chia-Shiung Tsai | 2019-12-17 |
| 10509312 | Approach for ultra thin-film transfer and handling | Chang-Ming Wu, Chia-Shiung Tsai, Xin-Hua Huang | 2019-12-17 |
| 10497667 | Apparatus for bond wave propagation control | Xin-Hua Huang, Kuan-Liang Liu, Kuo-Liang Lu | 2019-12-03 |
| 10453889 | Dual facing BSI image sensors with wafer level stacking | Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen, Pin-Nan Tseng | 2019-10-22 |
| 10384933 | Method of forming micro electromechanical system sensor | Chun-Wen Cheng, Hung-Chia Tsai, Lan-Lin Chao, Yuan-Chih Hsieh | 2019-08-20 |
| 10354972 | Hybrid bonding systems and methods for semiconductor wafers | Shih-Wei Lin, Xin-Hua Huang, Lan-Lin Chao, Chia-Shiung Tsai | 2019-07-16 |
| 10351418 | Bond rings in semiconductor devices and methods of forming same | Chih-Ming Chen, Chung-Yi Yu, Yeur-Luen Tu | 2019-07-16 |
| 10294098 | Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer | Hung-Hua Lin, Chang-Ming Wu, Chung-Yi Yu, Jung-Huei Peng | 2019-05-21 |
| 10280076 | Semiconductor structure and manufacturing method thereof | Hung-Hua Lin, Kuan-Liang Liu, Chia-Shiung Tsai, Alexander Kalnitsky | 2019-05-07 |
| 10283448 | Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same | Kai-Wen Cheng, Xin-Hua Huang, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen | 2019-05-07 |