Issued Patents 2019
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10508027 | CMOS-MEMS structure and method of forming the same | Chia-Hua Chu, Fei-Lung Lai, Shiang-Chi Lin | 2019-12-17 |
| 10508023 | MEMS devices including MEMS dies and connectors thereto | Chun-Wen Cheng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2019-12-17 |
| 10486153 | Method to produce chemical pattern in micro-fluidic structure | Shang-Ying Tsai, Li-Min Hung | 2019-11-26 |
| 10351417 | MEMS device with viewer window and manufacturing method thereof | Chun-Wen Cheng, Chi-Hang Chin, Chia-Hua Chu, Shang-Ying Tsai | 2019-07-16 |
| 10294098 | Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer | Hung-Hua Lin, Chang-Ming Wu, Chung-Yi Yu, Ping-Yin Liu | 2019-05-21 |
| 10273148 | Micro-electro-mechanical system and manufacturing method thereof | Chun-Wen Cheng, Chia-Hua Chu, Nien-Tsung Tsai, Yao-Te Huang, Li-Min Hung +1 more | 2019-04-30 |
| 10273142 | Semiconductor MEMS structure | Yuan-Chih Hsieh, Hsing-Lien Lin, Yi-Chien Wu | 2019-04-30 |
| 10273144 | Multi-pressure MEMS package | Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng, Kuei-Sung Chang | 2019-04-30 |
| 10266396 | MEMS device with enhanced sensing structure and manufacturing method thereof | Ching-Kai Shen, Wen-Chuan Tai, Chia-Ming Hung, Hsiang-Fu Chen, Chun-Wen Cheng | 2019-04-23 |
| 10266390 | Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring | Shang-Ying Tsai, Hsin-Ting Huang, Lung Yuan Pan, Hung-Hua Lin, Yao-Te Huang | 2019-04-23 |
| 10202278 | Semiconductor structure with cavity spacing monitoring functions | Yi-Chien Wu, Yu-Chia Liu, Chun-Wen Cheng | 2019-02-12 |