Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10464808 | Semiconductor arrangement and formation thereof | Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Chia-Ming Hung, Shao-Chi Yu +1 more | 2019-11-05 |
| 10294098 | Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer | Chang-Ming Wu, Chung-Yi Yu, Ping-Yin Liu, Jung-Huei Peng | 2019-05-21 |
| 10280076 | Semiconductor structure and manufacturing method thereof | Ping-Yin Liu, Kuan-Liang Liu, Chia-Shiung Tsai, Alexander Kalnitsky | 2019-05-07 |
| 10266390 | Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring | Shang-Ying Tsai, Hsin-Ting Huang, Lung Yuan Pan, Jung-Huei Peng, Yao-Te Huang | 2019-04-23 |