Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10494252 | MEMS devices and methods of manufacturing the same | Chia-Hua Chu, Chun-Wen Cheng | 2019-12-03 |
| 10358339 | Micro-electro-mechanical device having low thermal expansion difference | Ming-Han Tsai, Wei-Leun Fang | 2019-07-23 |
| 10273144 | Multi-pressure MEMS package | Chia-Hua Chu, Chun-Wen Cheng, Kuei-Sung Chang, Jung-Huei Peng | 2019-04-30 |
| 10273148 | Micro-electro-mechanical system and manufacturing method thereof | Chun-Wen Cheng, Jung-Huei Peng, Chia-Hua Chu, Nien-Tsung Tsai, Yao-Te Huang +1 more | 2019-04-30 |
| 10202278 | Semiconductor structure with cavity spacing monitoring functions | Jung-Huei Peng, Yi-Chien Wu, Chun-Wen Cheng | 2019-02-12 |