Issued Patents 2019
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10520467 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Kai-Chih Liang, Chia-Hua Chu, Chun-Ren Cheng | 2019-12-31 |
| 10519032 | MEMS pressure sensor and microphone devices having through-vias and methods of forming same | Chia-Hua Chu | 2019-12-31 |
| 10513429 | Integration scheme for microelectromechanical systems (MEMS) devices and complementary metal-oxide-semiconductor (CMOS) devices | Chia-Hua Chu | 2019-12-24 |
| 10508345 | Sensor in an internet-of-things and manufacturing method of the same | Ming-Ta Lei, Chia-Hua Chu, Hsin-Chih Chiang, Tung-Tsun Chen | 2019-12-17 |
| 10508029 | MEMS integrated pressure sensor devices and methods of forming same | Chia-Hua Chu | 2019-12-17 |
| 10508023 | MEMS devices including MEMS dies and connectors thereto | Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2019-12-17 |
| 10494252 | MEMS devices and methods of manufacturing the same | Yu-Chia Liu, Chia-Hua Chu | 2019-12-03 |
| 10486964 | Method for forming a micro-electro mechanical system (MEMS) including bonding a MEMS substrate to a CMOS substrate via a blocking layer | Chia-Hua Chu | 2019-11-26 |
| 10473616 | Backside CMOS compatible BioFET with no plasma induced damage | Yi-Shao Liu, Chun-Ren Cheng, Ching-Ray Chen, Yi-Hsien Chang, Fei-Lung Lai | 2019-11-12 |
| 10472233 | Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer | Chia-Hua Chu | 2019-11-12 |
| 10429341 | Method of using integrated electro-microfluidic probe card | Yi-Shao Liu, Fei-Lung Lai, Chun-Ren Cheng | 2019-10-01 |
| 10384933 | Method of forming micro electromechanical system sensor | Hung-Chia Tsai, Lan-Lin Chao, Yuan-Chih Hsieh, Ping-Yin Liu | 2019-08-20 |
| 10351417 | MEMS device with viewer window and manufacturing method thereof | Chi-Hang Chin, Jung-Huei Peng, Chia-Hua Chu, Shang-Ying Tsai | 2019-07-16 |
| 10273148 | Micro-electro-mechanical system and manufacturing method thereof | Jung-Huei Peng, Chia-Hua Chu, Nien-Tsung Tsai, Yao-Te Huang, Li-Min Hung +1 more | 2019-04-30 |
| 10273144 | Multi-pressure MEMS package | Yu-Chia Liu, Chia-Hua Chu, Kuei-Sung Chang, Jung-Huei Peng | 2019-04-30 |
| 10266396 | MEMS device with enhanced sensing structure and manufacturing method thereof | Ching-Kai Shen, Wen-Chuan Tai, Chia-Ming Hung, Hsiang-Fu Chen, Jung-Huei Peng | 2019-04-23 |
| 10202278 | Semiconductor structure with cavity spacing monitoring functions | Jung-Huei Peng, Yi-Chien Wu, Yu-Chia Liu | 2019-02-12 |
| 10184912 | Backside sensing BioFET with enhanced performance | Yi-Shao Liu, Fei-Lung Lai, Wei-Cheng Lin, Ta-Chuan Liao, Chien-Kuo Yang | 2019-01-22 |