Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10384933 | Method of forming micro electromechanical system sensor | Chun-Wen Cheng, Hung-Chia Tsai, Yuan-Chih Hsieh, Ping-Yin Liu | 2019-08-20 |
| 10354972 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Xin-Hua Huang, Chia-Shiung Tsai | 2019-07-16 |
| 10283448 | Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same | Ping-Yin Liu, Kai-Wen Cheng, Xin-Hua Huang, Chia-Shiung Tsai, Xiaomeng Chen | 2019-05-07 |
| 10276678 | Semiconductor device and fabrication method thereof | Chun-Han Tsao, Chih-Ming Chen, Han-Yu Chen, Szu-Yu Wang, Cheng-Yuan Tsai | 2019-04-30 |