Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10509312 | Approach for ultra thin-film transfer and handling | Ping-Yin Liu, Chang-Ming Wu, Chia-Shiung Tsai | 2019-12-17 |
| 10497667 | Apparatus for bond wave propagation control | Kuan-Liang Liu, Kuo-Liang Lu, Ping-Yin Liu | 2019-12-03 |
| 10492278 | Bluetooth controller | Wenbin Zhang, Huiping CHEN, Guangli Guo, Zhiguang PENG | 2019-11-26 |
| 10410892 | Method of semiconductor wafer bonding and system thereof | Kuan-Liang Lu, Yeur-Luen Tu | 2019-09-10 |
| 10354972 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Lan-Lin Chao, Chia-Shiung Tsai | 2019-07-16 |
| 10283448 | Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same | Ping-Yin Liu, Kai-Wen Cheng, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen | 2019-05-07 |
| 10219003 | Intra-frame predictive coding and decoding methods based on template matching, array scanning method and apparatus, and apparatus | Haitao Yang | 2019-02-26 |