Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510597 | Methods for hybrid wafer bonding integrated with CMOS processing | Chia-Shiung Tsai, Ping-Yin Liu | 2019-12-17 |
| 10453889 | Dual facing BSI image sensors with wafer level stacking | Ping-Yin Liu, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen | 2019-10-22 |