Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510865 | Cap layer and anneal for gapfill improvement | Chien-Hao Chen | 2019-12-17 |
| 10504747 | Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending | Chien-Hao Chen, Chia-Ao Chang, Pin-Ju Liang | 2019-12-10 |
| 10504724 | Selective film growth for bottom-up gap filling | Yu-Lien Huang | 2019-12-10 |
| 10483170 | Method of semiconductor integrated circuit fabrication | Chia Ping Lo, Liang-Gi Yao, Weng Chang, Yee-Chia Yeo, Ziwei Fang | 2019-11-19 |
| 10468501 | Gap-filling germanium through selective bottom-up growth | Chien-Hao Chen, Ziwei Fang, Yee-Chia Yeo | 2019-11-05 |
| 10347741 | Gapfill improvement | Pin-Ju Liang, Yi-Cheng Li, Chien-Hao Chen | 2019-07-09 |
| 10332746 | Post UV cure for gapfill improvement | Chien-Hao Chen, Chih-Tang Peng, Jei-Ming Chen, Shu-Yi Wang | 2019-06-25 |
| 10249530 | Interlayer dielectric film in semiconductor devices | Tsan-Chun Wang, Ziwei Fang, Yi-Fan Chen | 2019-04-02 |
| 10170305 | Selective film growth for bottom-up gap filling | Yu-Lien Huang | 2019-01-01 |