Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504747 | Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending | De-Wei Yu, Chien-Hao Chen, Pin-Ju Liang | 2019-12-10 |
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Chia-Ao Chang
Overall (2019): #516,556 of 560,194Top 95%
1
Patents 2019