Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504747 | Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending | De-Wei Yu, Chien-Hao Chen, Chia-Ao Chang | 2019-12-10 |
| 10347741 | Gapfill improvement | De-Wei Yu, Yi-Cheng Li, Chien-Hao Chen | 2019-07-09 |