CC

Chien-Hao Chen

TSMC: 8 patents #207 of 3,065Top 7%
UM United Microelectronics: 3 patents #127 of 707Top 20%
FC Fujian Jinhua Integrated Circuit Co.: 1 patents #64 of 91Top 75%
📍 Shiwen, TW: #1 of 8 inventorsTop 15%
Overall (2019): #7,667 of 560,194Top 2%
11
Patents 2019

Issued Patents 2019

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
10515963 Field effect transistor contact with reduced contact resistance Su-Hao Liu, Yan-Ming Tsai, Chung-Ting Wei, Ziwei Fang, Chih-Wei Chang +1 more 2019-12-24
10510865 Cap layer and anneal for gapfill improvement De-Wei Yu 2019-12-17
10504747 Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending De-Wei Yu, Chia-Ao Chang, Pin-Ju Liang 2019-12-10
10468501 Gap-filling germanium through selective bottom-up growth De-Wei Yu, Ziwei Fang, Yee-Chia Yeo 2019-11-05
10347741 Gapfill improvement Pin-Ju Liang, De-Wei Yu, Yi-Cheng Li 2019-07-09
10332746 Post UV cure for gapfill improvement De-Wei Yu, Chih-Tang Peng, Jei-Ming Chen, Shu-Yi Wang 2019-06-25
10312158 Method for forming semiconductor device structure with gate structure Yi-Cheng Li, Yung-Cheng Lu, Jr-Jung Lin, Chun-Hung Lee, Chao-Cheng Chen 2019-06-04
10276395 Method for manufacturing semiconductor device Feng-Lun Wu, Chung-Ping Hsia, Sho-Shen Lee 2019-04-30
10269799 Field effect transistor contact with reduced contact resistance Su-Hao Liu, Yan-Ming Tsai, Chung-Ting Wei, Ziwei Fang, Chih-Wei Chang +1 more 2019-04-23
10199228 Manufacturing method of metal gate structure Nien-Ting Ho, Hsin-Fu Huang, Chi-Yuan Sun, Wei-Yu Chen, Min-Chuan Tsai +2 more 2019-02-05
10170623 Method of fabricating semiconductor device En-Chiuan Liou, Tang-Chun Weng 2019-01-01