Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483169 | FinFET cut-last process using oxide trench fill | Yen-Chun Huang, Kuang-Yuan Hsu, Tai-Chun Huang, Tsu-Hsiu Perng, Tien-I Bao | 2019-11-19 |
| 10468409 | FinFET device with oxidation-resist STI liner structure | Szu-Ping Lee, Jian-Shiou Huang, Sung-En Lin | 2019-11-05 |
| 10418271 | Method of forming isolation layer | Teng-Chun Tsai, Li-Ting Wang, De-Fang Chen, Cheng-Tung Lin, Chien-Hsun Wang +3 more | 2019-09-17 |
| 10388531 | Self-aligned insulated film for high-k metal gate device | Jin-Aun Ng, Bao-Ru Young, Harry-Hak-Lay Chuang, Maxi Chang, Chih-Yang Yeh +8 more | 2019-08-20 |
| 10361113 | Formation and in-situ treatment processes for gap fill layers | Jian-Shiou Huang, Bang-Tai Tang, Tai-Chun Huang, Yen-Chun Huang | 2019-07-23 |
| 10354923 | Semiconductor device and method for atomic layer deposition of a dielectric over a substrate | Yen-Chun Huang, Bang-Tai Tang, Tai-Chun Huang | 2019-07-16 |
| 10332746 | Post UV cure for gapfill improvement | De-Wei Yu, Chien-Hao Chen, Jei-Ming Chen, Shu-Yi Wang | 2019-06-25 |
| 10325994 | Semiconductor device and method of forming vertical structure | Tai-Chun Huang, Teng-Chun Tsai, Cheng-Tung Lin, De-Fang Chen, Li-Ting Wang +4 more | 2019-06-18 |
| 10269937 | Semiconductor strips with undercuts and methods for forming the same | Tai-Chun Huang, Chia-Wei Chang, Ming-Hua Yu, Hao-Ming Lien, Chao-Cheng Chen +1 more | 2019-04-23 |