Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483169 | FinFET cut-last process using oxide trench fill | Chih-Tang Peng, Kuang-Yuan Hsu, Tai-Chun Huang, Tsu-Hsiu Perng, Tien-I Bao | 2019-11-19 |
| 10361113 | Formation and in-situ treatment processes for gap fill layers | Jian-Shiou Huang, Bang-Tai Tang, Chih-Tang Peng, Tai-Chun Huang | 2019-07-23 |
| 10354923 | Semiconductor device and method for atomic layer deposition of a dielectric over a substrate | Bang-Tai Tang, Chih-Tang Peng, Tai-Chun Huang | 2019-07-16 |
| 10197384 | Window frame measuring method | CHUN JAN HSU | 2019-02-05 |