Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453748 | Methods of forming semiconductor device structures including stair step structures | Matthew Park, Adam L. Olson | 2019-10-22 |
| 10381443 | Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device | Kazuyo Matsumoto, Yasuo Kasagi, Satoshi Shimizu, Hiroyuki Ogawa, Yohei Masamori +2 more | 2019-08-13 |
| 10354956 | Three-dimensional memory device containing hydrogen diffusion barrier structures for CMOS under array architecture and method of making the same | Daxin Mao, Hiroyuki Ogawa, Johann Alsmeier | 2019-07-16 |
| 10269620 | Multi-tier memory device with through-stack peripheral contact via structures and method of making thereof | Zhenyu Lu, Hiroyuki Ogawa, Daxin Mao, Kensuke Yamaguchi, Sung-Tae Lee +2 more | 2019-04-23 |
| 10256248 | Through-memory-level via structures between staircase regions in a three-dimensional memory device and method of making thereof | Zhenyu Lu, Johann Alsmeier, Fumiaki Toyama, Yuki Mizutani, Hiroyuki Ogawa +5 more | 2019-04-09 |
| 10249640 | Within-array through-memory-level via structures and method of making thereof | Zhenyu Lu, Alexander Chu, Kensuke Yamaguchi, Hiroyuki Ogawa, Daxin Mao +2 more | 2019-04-02 |
| 10217746 | Three-dimensional memory device having L-shaped word lines and a support structure and methods of making the same | Tae Kyung Kim, Raghuveer S. Makala, Yanli Zhang, Hiroyuki Kinoshita, Daxin Mao +5 more | 2019-02-26 |