Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381371 | Through-memory-level via structures for a three-dimensional memory device | Hiroyuki Ogawa, Fumiaki Toyama | 2019-08-13 |
| 10256248 | Through-memory-level via structures between staircase regions in a three-dimensional memory device and method of making thereof | Zhenyu Lu, Jixin Yu, Johann Alsmeier, Fumiaki Toyama, Hiroyuki Ogawa +5 more | 2019-04-09 |