Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510738 | Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof | Kwang Ho Kim, Masaaki Higashitani, Akio Nishida | 2019-12-17 |
| 10381371 | Through-memory-level via structures for a three-dimensional memory device | Hiroyuki Ogawa, Yuki Mizutani | 2019-08-13 |
| 10319680 | Metal contact via structure surrounded by an air gap and method of making thereof | Jongsun Sel, Masaaki Higashitani, Mohan Dunga, Peter Rabkin | 2019-06-11 |
| 10256248 | Through-memory-level via structures between staircase regions in a three-dimensional memory device and method of making thereof | Zhenyu Lu, Jixin Yu, Johann Alsmeier, Yuki Mizutani, Hiroyuki Ogawa +5 more | 2019-04-09 |