Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10516025 | Three-dimensional NAND memory containing dual protrusion charge trapping regions and methods of manufacturing the same | Masatoshi Nishikawa, Hisakazu Otoi | 2019-12-24 |
| 10515897 | Three-dimensional memory device containing hydrogen diffusion blocking structures and method of making the same | Masatoshi Nishikawa, Murshed Chowdhury, Takahito Fujita, Kiyokazu Shishido, Hiroyuki Ogawa | 2019-12-24 |
| 10510738 | Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof | Kwang Ho Kim, Masaaki Higashitani, Fumiaki Toyama | 2019-12-17 |
| 10354987 | Three-dimensional memory device containing bonded chip assembly with through-substrate via structures and method of making the same | Mitsuteru Mushiga, Kenji Sugiura, Hisakazu Otoi, Masatoshi Nishikawa | 2019-07-16 |
| 10354980 | Three-dimensional memory device containing bonded chip assembly with through-substrate via structures and method of making the same | Mitsuteru Mushiga, Kenji Sugiura, Hisakazu Otoi, Masatoshi Nishikawa | 2019-07-16 |
| 10355100 | Field effect transistors having different stress control liners and method of making the same | Yu Ueda, Tomoyuki Obu, Kazutaka Yoshizawa, Yasuyuki Aoki, Eisuke Takii | 2019-07-16 |
| 10283566 | Three-dimensional memory device with through-stack contact via structures and method of making thereof | Jongsun Sel, Tuan Pham, Mitsuteru Mushiga, Yoshihiro Ikeda, Daewung Kang | 2019-05-07 |
| 10283493 | Three-dimensional memory device containing bonded memory die and peripheral logic die and method of making thereof | — | 2019-05-07 |
| 10224373 | Three-dimensional ReRAM memory device employing replacement word lines and methods of making the same | Jongsun Sel, Mitsuteru Mushiga, Vincent Shih, Tuan Pham | 2019-03-05 |