Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283566 | Three-dimensional memory device with through-stack contact via structures and method of making thereof | Jongsun Sel, Mitsuteru Mushiga, Yoshihiro Ikeda, Daewung Kang, Akio Nishida | 2019-05-07 |
| 10224373 | Three-dimensional ReRAM memory device employing replacement word lines and methods of making the same | Jongsun Sel, Mitsuteru Mushiga, Vincent Shih, Akio Nishida | 2019-03-05 |