Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283566 | Three-dimensional memory device with through-stack contact via structures and method of making thereof | Jongsun Sel, Tuan Pham, Mitsuteru Mushiga, Yoshihiro Ikeda, Akio Nishida | 2019-05-07 |