Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510721 | Molded chip combination | Milind S. Bhagavat, Lei Fu, Chia-Ken Leong, Rahul Agarwal | 2019-12-17 |
| 10319606 | Chip package assembly with enhanced interconnects and method for fabricating the same | Jaspreet S. Gandhi, Tien-Yu Lee, Henley Liu, Suresh Ramalingam | 2019-06-11 |