Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319606 | Chip package assembly with enhanced interconnects and method for fabricating the same | Jaspreet S. Gandhi, Henley Liu, Ivor G. Barber, Suresh Ramalingam | 2019-06-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319606 | Chip package assembly with enhanced interconnects and method for fabricating the same | Jaspreet S. Gandhi, Henley Liu, Ivor G. Barber, Suresh Ramalingam | 2019-06-11 |