Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468351 | Multi-chip silicon substrate-less chip packaging | Woon-Seong Kwon | 2019-11-05 |
| 10319606 | Chip package assembly with enhanced interconnects and method for fabricating the same | Jaspreet S. Gandhi, Tien-Yu Lee, Henley Liu, Ivor G. Barber | 2019-06-11 |
| 10262920 | Stacked silicon package having a thermal capacitance element | Gamal Refai-Ahmed, Brian D. Philofsky, Anthony Torza | 2019-04-16 |