Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510721 | Molded chip combination | Milind S. Bhagavat, Lei Fu, Ivor G. Barber, Rahul Agarwal | 2019-12-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510721 | Molded chip combination | Milind S. Bhagavat, Lei Fu, Ivor G. Barber, Rahul Agarwal | 2019-12-17 |