Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510721 | Molded chip combination | Lei Fu, Ivor G. Barber, Chia-Ken Leong, Rahul Agarwal | 2019-12-17 |
| 10431517 | Arrangement and thermal management of 3D stacked dies | John Wuu, Samuel D. Naffziger, Patrick J. Shyvers, Kaushik Mysore, Brett P. Wilkerson | 2019-10-01 |
| 10312221 | Stacked dies and dummy components for improved thermal performance | Rahul Agarwal, Kaushik Mysore Srinivasa Setty, Brett P. Wilkerson | 2019-06-04 |