Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431517 | Arrangement and thermal management of 3D stacked dies | John Wuu, Samuel D. Naffziger, Patrick J. Shyvers, Milind S. Bhagavat, Kaushik Mysore | 2019-10-01 |
| 10312221 | Stacked dies and dummy components for improved thermal performance | Rahul Agarwal, Kaushik Mysore Srinivasa Setty, Milind S. Bhagavat | 2019-06-04 |