Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10431517 | Arrangement and thermal management of 3D stacked dies | John Wuu, Samuel D. Naffziger, Patrick J. Shyvers, Milind S. Bhagavat, Brett P. Wilkerson | 2019-10-01 | $27,042,000 |