Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10509752 | Configuration of multi-die modules with through-silicon vias | Russell Schreiber, John Wuu, Michael Kevin Ciraula | 2019-12-17 |
| 10431517 | Arrangement and thermal management of 3D stacked dies | John Wuu, Samuel D. Naffziger, Milind S. Bhagavat, Kaushik Mysore, Brett P. Wilkerson | 2019-10-01 |
| 10333500 | Self-gating pulsed flip-flop | David S. Vickers | 2019-06-25 |
| 10311191 | Memory including side-car arrays with irregular sized entries | John Wuu, Ryan Alan Selby | 2019-06-04 |