JH

Joshua D. Heppner

IN Intel: 5 patents #516 of 5,769Top 9%
Overall (2019): #34,651 of 560,194Top 7%
5
Patents 2019

Issued Patents 2019

Patent #TitleCo-InventorsDate
10446461 Complex cavity formation in molded packaging structures Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff 2019-10-15
10325866 Electronic device packages with conformal EMI shielding and related methods Eric J. Li, Rajendra C. Dias, Mitul Modi 2019-06-18
10224290 Electromagnetically shielded electronic devices and related systems and methods Rajendra C. Dias, Takashi Kumamoto, Yoshishiro Tomita, Mitul Modi, Eric J. Li 2019-03-05
10205292 Socket contact techniques and configurations Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny +3 more 2019-02-12
10193493 Multi-surface solar cell packaging for self-powered electronic devices Debendra Mallik 2019-01-29