Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504857 | Semiconductor package structure for improving die warpage and manufacturing method thereof | Byong Woo Cho, Cha Gyu Song | 2019-12-10 |
| 10490332 | Inductor | Jae-hyun Kwon | 2019-11-26 |
| 10444924 | Touch display apparatus | Ju Han Kim, Yong Chan Park, Seung Kyeom Kim | 2019-10-15 |
| 10354798 | Multilayer ceramic capacitor | Jae Sung Park, Jong Han Kim, Jeong Yun Park, Jae Yeol Choi, Sea Han Na Doo | 2019-07-16 |
| 10347562 | Methods and structures for increasing the allowable die size in TMV packages | Louis W. Nicholls, Roger D. St. Amand, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2019-07-09 |
| 10321525 | Control panel and microwave oven | Chul-woo Lee, Sun-Ki Kim | 2019-06-11 |
| 10310345 | In-cell touch liquid crystal display apparatus, method of manufacturing the same, method of manufacturing thin film transistor array substrate, and method of manufacturing color filter array substrate | Yong Chan Park, Seung Kyeom Kim | 2019-06-04 |
| 10297552 | Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects | Ye Sul Ahn, Cha Gyu Song | 2019-05-21 |
| 10242966 | Thin bonded interposer package | Christopher J. Berry, Roger D. St. Amand | 2019-03-26 |