Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10524350 | Apparatus and methods related to conformal coating implemented with surface mount devices | Anthony James LoBianco, Howard E. Chen, Hoang Mong Nguyen, Matthew Sean Read, Lori Ann DeOrio | 2019-12-31 |
| 10497656 | Dual-sided module with land-grid array (LGA) footprint | Howard E. Chen, Anthony James LoBianco | 2019-12-03 |
| 10460957 | Control of under-fill using an encapsulant for a dual-sided ball grid array package | — | 2019-10-29 |
| 10418318 | Fine pitch copper pillar package and method | David McCann, John McCormick, Louis W. Nicholls | 2019-09-17 |
| 10410885 | Control of under-fill using under-fill deflash for a dual-sided ball grid array package | — | 2019-09-10 |
| 10361145 | Through-mold openings for dual-sided packaged modules with ball grid arrays | Howard E. Chen, Hoang Mong Nguyen, Anthony James LoBianco | 2019-07-23 |
| 10347562 | Methods and structures for increasing the allowable die size in TMV packages | Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang | 2019-07-09 |
| 10224270 | Fine pitch copper pillar package and method | David McCann, John McCormick, Louis W. Nicholls | 2019-03-05 |