Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347562 | Methods and structures for increasing the allowable die size in TMV packages | Louis W. Nicholls, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2019-07-09 |
| 10242966 | Thin bonded interposer package | Christopher J. Berry, Jin Seong Kim | 2019-03-26 |
| 10192816 | Semiconductor package and fabricating method thereof | Michael Kelly, David Jon Hiner, Ronald Patrick Huemoeller | 2019-01-29 |