Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418318 | Fine pitch copper pillar package and method | Robert Francis Darveaux, David McCann, John McCormick | 2019-09-17 |
| 10347562 | Methods and structures for increasing the allowable die size in TMV packages | Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2019-07-09 |
| 10224270 | Fine pitch copper pillar package and method | Robert Francis Darveaux, David McCann, John McCormick | 2019-03-05 |