Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504857 | Semiconductor package structure for improving die warpage and manufacturing method thereof | Jin Seong Kim, Byong Woo Cho | 2019-12-10 |
| 10297552 | Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects | Jin Seong Kim, Ye Sul Ahn | 2019-05-21 |