Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504857 | Semiconductor package structure for improving die warpage and manufacturing method thereof | Jin Seong Kim, Cha Gyu Song | 2019-12-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504857 | Semiconductor package structure for improving die warpage and manufacturing method thereof | Jin Seong Kim, Cha Gyu Song | 2019-12-10 |