Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297552 | Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects | Jin Seong Kim, Cha Gyu Song | 2019-05-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297552 | Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects | Jin Seong Kim, Cha Gyu Song | 2019-05-21 |