Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510733 | Integrated device comprising embedded package on package (PoP) device | Rajneesh Kumar, Milind Shah | 2019-12-17 |
| 10431511 | Power amplifier with RF structure | Daeik Daniel Kim, Shu Zhang, Bonhoon Koo, Manuel Aldrete, Jie Fu +2 more | 2019-10-01 |
| 10410971 | Thermal and electromagnetic interference shielding for die embedded in package substrate | David Fraser Rae, Hong Bok We, Christopher J. Healy | 2019-09-10 |
| 10403707 | Array type inductor | Hong Bok We, Joonsuk Park | 2019-09-03 |
| 10325855 | Backside drill embedded die substrate | Daeik Daniel Kim, Jie Fu, Changhan Hobie Yun, Manuel Aldrete, Chengjie Zuo +2 more | 2019-06-18 |