Issued Patents 2019
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10476227 | Dual bond pad structure for photonics | Richard S. Graf, Robert K. Leidy, Jeffrey C. Maling | 2019-11-12 |
| 10453987 | Photodiode structures | John J. Ellis-Monaghan, Mark D. Jaffe, Kirk D. Peterson | 2019-10-22 |
| 10446421 | Crystal oscillator and the use thereof in semiconductor fabrication | Cyril Cabral, Jr., Lawrence A. Clevenger, John M. Cohn, William J. Murphy, Anthony J. Telensky | 2019-10-15 |
| 10438803 | Semiconductor structures having low resistance paths throughout a wafer | Thomas J. Hartswick, Zhong-Xiang He, Anthony K. Stamper, Eric J. White | 2019-10-08 |
| 10431614 | Edge seals for semiconductor packages | Kyle Thomas, David T. Price, Rusty WINZENREAD, Bruce Greenwood | 2019-10-01 |
| 10424686 | Photodiode structures | John J. Ellis-Monaghan, Mark D. Jaffe, Kirk D. Peterson | 2019-09-24 |
| 10409006 | Photonics chip | Wolfgang Sauter, Christopher D. Muzzy, Charles L. Arvin, Robert K. Leidy | 2019-09-10 |
| 10403659 | Stacked image sensor capacitors and related methods | Angel Rodriguez, David T. Price, Jeffery A. Neuls, Kenneth A. Bates, Rick Mauritzson | 2019-09-03 |
| 10361123 | Backside contact to a final substrate | Mark D. Jaffe, Steven M. Shank, Anthony K. Stamper | 2019-07-23 |
| 10324056 | Moisture detection and ingression monitoring systems and methods of manufacture | Fen Chen, Carole D. Graas, Wen Liu, Prakash Periasamy | 2019-06-18 |
| 10309919 | Moisture detection and ingression monitoring systems and methods of manufacture | Fen Chen, Carole D. Graas, Wen Liu, Prakash Periasamy | 2019-06-04 |
| 10290599 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Christopher D. Muzzy, Wolfgang Sauter | 2019-05-14 |
| 10224280 | Backside device contact | Mark D. Jaffe, Steven M. Shank, Anthony K. Stamper | 2019-03-05 |
| 10224276 | Integrated circuit including wire structure, related method and design structure | Edward C. Cooney, III, Zhong-Xiang He, Robert K. Leidy | 2019-03-05 |
| 10224225 | Centering substrates on a chuck | Shawn A. Adderly, Samantha D. DiStefano, Max G. Levy, Max L. Lifson, Matthew D. Moon +1 more | 2019-03-05 |
| 10204877 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Charles F. Musante, Christopher D. Muzzy, Wolfgang Sauter | 2019-02-12 |
| 10191213 | Shielding structures between optical waveguides | John J. Ellis-Monaghan, Mark D. Jaffe, Kirk D. Peterson, Jed H. Rankin | 2019-01-29 |
| 10192839 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Christopher D. Muzzy, Wolfgang Sauter | 2019-01-29 |
| 10177000 | Semiconductor structures having low resistance paths throughout a wafer | Thomas J. Hartswick, Zhong-Xiang He, Anthony K. Stamper, Eric J. White | 2019-01-08 |
| 10170418 | Backside device contact | Mark D. Jaffe, Steven M. Shank, Anthony K. Stamper | 2019-01-01 |
| 10170224 | Low temperature fabrication of lateral thin film varistor | Richard S. Graf, Sudeep Mandal | 2019-01-01 |