Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483233 | Split ball grid array pad for multi-chip modules | Anson J. Call, Erwin B. Cohen, Dany Minier, David B. Stone, Eric W. Tremble | 2019-11-19 |
| 10409006 | Photonics chip | Jeffrey P. Gambino, Christopher D. Muzzy, Charles L. Arvin, Robert K. Leidy | 2019-09-10 |
| 10290599 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy | 2019-05-14 |
| 10204877 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Jeffrey P. Gambino, Charles F. Musante, Christopher D. Muzzy | 2019-02-12 |
| 10192839 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy | 2019-01-29 |
| 10170446 | Structures and methods to enable a full intermetallic interconnect | Charles L. Arvin, Christopher D. Muzzy | 2019-01-01 |